# Data Bonding: limits and capabilities

Data version 6d29e2f86993, built 2026-10-26; facts on this page checked 2026-10-21.

Limits and capabilities of [Data Bonding](https://specs-dev.teradek.com/services/svc.data-bonding.md), every field with its source and date. A field no source publishes reads "Not collected yet."; that is not a "no".

- Data Bonding: what it is: Multi-WAN high-speed data bonding service combining cellular, satellite, and wired connections into a single resilient internet connection. Source: Teradek product data, seen 2026-10-21.

## Limits

- <a id="limits-latency_ms_typical"></a>Data Bonding: typical latency 100 ms. Source: Teradek product data, seen 2026-10-21. This is Teradek's figure, with test conditions not stated.
- <a id="limits-max_bit_depth"></a>Data Bonding: highest bit depth 10-bit. Source: Teradek product data, seen 2026-10-21.
- <a id="limits-max_bitrate_mbps"></a>Data Bonding: highest bitrate 1000 Mbps. Source: Teradek product data, seen 2026-10-21.
- <a id="limits-max_concurrent_inputs"></a>Data Bonding: most concurrent inputs: 10 (8x 5G modems + 2x Gigabit WAN interfaces). Source: Teradek product data, seen 2026-10-21.
- <a id="limits-max_concurrent_viewers"></a>Data Bonding: most concurrent viewers: unlimited (IP network data clients). Source: Teradek product data, seen 2026-10-21.
- <a id="limits-max_destinations"></a>Data Bonding: most destinations: unlimited (full IP routing / debonding server exit). Source: Teradek product data, seen 2026-10-21.
- <a id="limits-max_resolution"></a>Data Bonding: highest resolution: Other. Source: Teradek product data, seen 2026-10-21.
- <a id="limits-retention_days"></a>Data Bonding: retention 30 days. Source: Teradek product data, seen 2026-10-21.
- <a id="limits-storage_gb_included"></a>Data Bonding: storage included 0. Source: Teradek product data, seen 2026-10-21.
- <a id="limits-multiview_max"></a>Data Bonding: most feeds in one multiview — Not collected yet.

## Capabilities

- <a id="capabilities-comms"></a>Data Bonding: communication tools: VoIP over bonded WAN, web comms. Source: Teradek product data, seen 2026-10-21.
- <a id="capabilities-egress_protocols"></a>Data Bonding: egress protocols: SRT, RIST, RTMP, RTMPS, RTSP, WebRTC, HLS, MPEG-TS, other. Source: Teradek product data, seen 2026-10-21.
- <a id="capabilities-ingest_protocols"></a>Data Bonding: ingest protocols: SRT, RIST, RTMP, RTMPS, RTSP, MPEG-TS, other. Source: Teradek product data, seen 2026-10-21.
- <a id="capabilities-local_mode"></a>Data Bonding: local mode: Local web GUI configuration and standalone local routing without cloud dependency. Source: Teradek product data, seen 2026-10-21.
- <a id="capabilities-recording"></a>Data Bonding: recording: No. Source: Teradek product data, seen 2026-10-21.
- <a id="capabilities-transcoding"></a>Data Bonding: transcoding: No. Source: Teradek product data, seen 2026-10-21.
- <a id="capabilities-core_share"></a>Data Bonding: core share — Not collected yet.

- <a id="platforms-api"></a>Data Bonding: API: Yes. Source: Teradek product data, seen 2026-10-21.
- <a id="platforms-api_docs_url"></a>Data Bonding: API documentation — Not collected yet.
- <a id="platforms-integrations"></a>Data Bonding: integrations: [Core Classic](https://specs-dev.teradek.com/services/svc.core-classic.md), [Bondix S-Treem](https://specs-dev.teradek.com/api/third-party/tp.bondix.s-treem), [AWS GovCloud](https://specs-dev.teradek.com/api/third-party/tp.amazon.govcloud), [Stripe](https://specs-dev.teradek.com/api/third-party/tp.stripe.stripe). Source: Teradek product data, seen 2026-10-21.

## Protocols

- Data Bonding, HLS: ingest not in the published list; egress supported.
- Data Bonding, MPEG-TS: ingest supported; egress supported.
- Data Bonding, RIST: ingest supported; egress supported.
- Data Bonding, RTMP: ingest supported; egress supported.
- Data Bonding, RTMPS: ingest supported; egress supported.
- Data Bonding, RTSP: ingest supported; egress supported.
- Data Bonding, SRT: ingest supported; egress supported.
- Data Bonding, TRT: ingest not in the published list; egress not in the published list.
- Data Bonding, WebRTC: ingest not in the published list; egress supported.
- Data Bonding, WHEP: ingest not in the published list; egress not in the published list.
- Data Bonding, WHIP: ingest not in the published list; egress not in the published list.
- Data Bonding, Other: ingest supported; egress supported.

## Not on this site

- Data Bonding: webhooks: Not collected yet.
- No field report (a third-party test, measurement or repair report) is held for Data Bonding; the figures here are Teradek's.

## Sources on this page

- [Teradek product data](https://specs-dev.teradek.com/sources/src.teradek-data-da800638.md)
- [Teradek product data](https://specs-dev.teradek.com/sources/src.teradek-data-9d5c41e0.md)

## Other topics

- [Plans and add-ons](https://specs-dev.teradek.com/services/svc.data-bonding/plans.md)
- [Billing rules](https://specs-dev.teradek.com/services/svc.data-bonding/rules.md)
- [Hosting, data residency and security](https://specs-dev.teradek.com/services/svc.data-bonding/hosting.md)
- [SLA, support and buying](https://specs-dev.teradek.com/services/svc.data-bonding/support.md)
- [Lifecycle and roadmap](https://specs-dev.teradek.com/services/svc.data-bonding/lifecycle.md)
- [Supported hardware and compatibility](https://specs-dev.teradek.com/services/svc.data-bonding/compatibility.md)

Summary: [/services/svc.data-bonding.md](https://specs-dev.teradek.com/services/svc.data-bonding.md).

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